Description General description An electroless nickel plating process designed for electroless nickel plating on copper, brass and copper alloy CLEANING PROCEDURE FOR COPPER SAMPLES: 1. Clean copper with some physical abrasion. 2. Dip for one minute in alkaline cleaner at 65°C (150°F). 3. Rinse with deionized water. 4. Dip for one minute in 30% HCl 5. Rinse with deionized water. PLATING BATH - USE AND CONTROL Operate bath at 95 °C. Plate for approximately one minute until surface of sample is completely nickel plated, then rinse with water. For build up of nickel deposit, use Nickelex (electroless nickel plating solution, ammonia free). Maintain pH of plating solution at 2.8 to 3.5 by adding ammonium hydroxide when pH falls below 2.8.