Description Application SiO2 is majorly used as a substrate material with excellent thermo-mechanical properties in a variety of applications which include: • vapour deposition • phase deposition • atomic force microscopy probes(AFM) • spin coating • electronic based devices Packaging 5 ea in padded box Features and Benefits An excellent substrate for microwave filters for applications in the wireless communication arena. Physical form Crystalline, hexagonal (a = 4.914 Å, c = 5.405 Å) Other Notes specific heat = 0.18 cal/g; thermoelectric constant = 1200μV/°C @ 300 °C; thermal conductivity = 0.0033 cal/cm°C; themal expansion (x10-6) = α11: 13.71, α33: 7.48; Q value = 1.8 × 106 min; acoustic velocity, SAW = 3160 m/sec; frequency constant, BAW = 1661 kHz/mm; piezoelectric coupling = K2 BAW: 0.65%, SAW: 0.14%