Description General description Tungsten etchant is a mixture of potassium hydroxide and potassium ferricyanide based solution that facilitates the removal of tungsten and other materials like aluminium by dipping the substrate into the etching solution. Packaging 500 mL in poly bottle Application Selective etchants for tungsten thin-film metallizations used in semiconductor and microelectronics technology. Etchants are buffered, mildly alkaline ferricyanide-based formulations providing high resolution patterns with minimal undercutting and photoresist compatibility. Controlled, uniform etching is achieved by immersion or spray etch technique. Features and Benefits Etch Rate (Immersion) 20 °C 30Å/sec. 30 °C 140Å/sec. 60 °C 250Å/sec. Rinse with DI water